Automated MEMS Pressure Sensor Assembly Line II
Introduction
The automated MEMS sensor packaging line integrates product calibration into the production line and is equipped with a CCD positioning system to assemble the products automatically. Empowered by parameter quantification, convenient debugging, and low failure rate, it achieves the independent design of each functional module, strong compatibility with different modules according to different customer requirements, modular design, simplified customization, and fast delivery.